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概要

Multilevel modeling is proposed as a new theoretical method for evaluation on creep damage at the elevated temperature. In the present method, microstructural change and evolution can be analyzed together with structural response analysis of specimens, parts or members. Creep deformation and stress analysis can be done with mechanical coupling with temperature transients and material transfer in diffusion. Through the combination of picture processing and automatic model generation, the unit-cell model for microscopic stress analysis can be directly deduced from SEM micrograph. Owing to the micromechanics on this actual microstructure model, the void generation, the void coalescence and crack formation can be simulated without further assumptions. Furthermore, the calculated equivalent stiffness can be utilized as a damage indicator to trace the accumulation of damage in the specified portion of materials. This method is available to describe the damage process in microstructure before fatal failure of materials.

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