粒子法を用いた溶接施工時の 高精度温度場評価に向けた検討
Study for Evaluation of Temperature Field during Welding using Particle Method
著者:
越智 申久 Nobuhisa OCHI 岡野 成威 Shigetaka OKANO 望月 正人 Masahito MOCHIZUKI
発刊日:
公開日:
GPUhybrid methodMPSParticle methodthermal conduction analysis
概要
Considering the effect of the complex phenomena during the welding, for example thermal deformation, phase transformation, residual stress, etc, is important when the welding process is used. All of the effects are caused by heat input and conduction during the welding. Therefore, evaluating the heat input and conduction properties during the welding is so important in order to understand and control the phenomena. However, the weld pool has a fluid flow with thermal conduction, a free surface, and an interface between liquid metal and solid metal. The dropped metal also supplies a free surface. These kinds of analysis are difficult to simulate using the grid method. In this study, Moving Particle Simulation (MPS), which represents the fluid flow as moving particles and can more easily evaluate the fluid flow and thermal conduction with a free surface than grid methods, is used the analysis. As a result, the thermal conduction analysis during the welding considering the thermal conduction and the fluid flow with a free surface in the weld pool, is performed.
