周波数掃引渦電流試験および周波数応答特性解析による金属板厚評
英字タイトル:
Thickness Measurement of Metal Plates Using Swept-Frequency Eddy Current Testing and Spectral Analysis
著者:
程 衛英 Weiying CHENG
発刊日:
公開日:
phasespectral analysisswept-frequency eddy current testingthickness measurement
Thickness Measurement of Metal Plates Using Swept-Frequency Eddy Current Testing and Spectral Analysis
著者:
程 衛英 Weiying CHENG
発刊日:
公開日:
カテゴリ: 第14回
キーワードタグ:phasespectral analysisswept-frequency eddy current testingthickness measurement
概要
Swept-frequency eddy current testing is applied to measure a metal plate’s thickness. The swept-frequency eddy current testing signals are normalized and spectral analysis was conducted on the normalized impedances. Theoretical and experimental studies show that the extreme value of the normalized impedance is correlated with the plate thickness. The thickness of a non-magnetic plate can be measured by SFECT and spectral analysis on the normalized impedance even without knowing the conductivity of the test object.
